Multi layer for encapsulation comprising a planarizing organic thin layer and a conformal organic thin layer
US9681501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2008 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Dec 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi layer encapsulating film includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in order of (a) a planarizing organic thin film, an inorganic thin film, a conformal organic thin film, and an inorganic thin film, (b) a conformal organic thin film, an inorganic thin film, a planarizing organic thin film, and an inorganic thin film, (c) a planarizing organic thin film, a conformal organic thin film, and an inorganic thin film, or (d) a conformal organic thin film, a planarizing organic thin film, and an inorganic thin film. The multi layer encapsulating film according to the invention can improve the surface roughness by using the planarizing organic thin film, and can enable particles to uniformly cover the device by using the conformal organic thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.