Microlithographic projection exposure apparatus and method of correcting optical wavefront deformations in such an apparatus

US9684251B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Joerg Holzmann · Aalen, DE
• Robert Weiss · Reutlingen, DE
• Toralf Gruner · Hennef (Sieg), DE

Key dates

• Filing date: Feb 29, 2016
• Grant date: Jun 20, 2017
• Expiry date: Mar 2, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70808
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A microlithographic projection exposure apparatus includes a correction device configured to correct optical wavefront deformations. The correction device includes first and second optical elements and a drive mechanism configured to move the first and second optical elements between a first arrangement and a second arrangement. In the first arrangement the first optical element is an inner optical element having at least a portion that is arranged in a projection light path, and the second optical element is an outer optical element that is arranged completely outside the projection light path. In the second arrangement the second optical element is the inner optical element, and the first optical element is the outer optical element. The correction device further includes a temperature control device configured to modify a temperature distribution in the outer optical element.