Patent · US Active

Module and method of manufacturing a module

US9691687B2 · kind B2 · utility

2Cited by

5References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Daniel Kehrer · Eferding, AT
Ulrich Krumbein · Rosenheim, DE
Beng Keh See · Melaka City, MY
Horst Theuss · Wenzenbach, DE
Helmut Wietschorke · Laberweinting, DE
Tze Yang Hin · Cupertino, US
Stefan Martens · Witzenhausen, DE

Key dates

Filing date	Apr 30, 2014
Grant date	Jun 27, 2017
Priority date	—
Expiry date	Aug 18, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/0547
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.