Lead frame for mounting semiconductor element and method for manufacturing the same
US9691689B2 · kind B2 · utility
2Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Mar 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting part or the terminal part of the lead frame, wherein the top end of the protrusion is substantially flat or the profile of the cross section of the top end is arc-shaped, and the top end of the protrusion is thick.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.