Semiconductor device and method for manufacturing the same
US9691730B2 · kind B2 · utility
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4Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present invention includes an insulating substrate having a circuit pattern, semiconductor elements bonded on the circuit pattern with a brazing material, and a wiring terminal bonded with a brazing material on an electrode provided on each of the semiconductor elements on an opposite side of the circuit pattern, in which a part of the wiring terminal is in contact with the insulating substrate, and insulated from the circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.