Miniaturized SMD diode package and process for producing the same
US9691735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Dec 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/186
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.