Miniaturized SMD diode package and process for producing the same
US9691736B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2015 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Oct 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/186
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.