Light emitting device package
US9691957B2 · kind B2 · utility
1Cited by
38References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2015 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | May 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
Abstract
The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.