Light emitting device package
US9691959B2 · kind B2 · utility
1Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2015 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Jan 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.