Magnetic-core three-dimensional (3D) inductors and packaging integration
US9693461B2 · kind B2 · utility
3Cited by
2References
24Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 10, 2015 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Aug 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A 3-dimensional (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.