Multi-substrate thermal management apparatus

US9696097B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Kallol Bera · San Jose, US
• Kim Vellore · San Jose, US
• Andrew J. Constant · Cupertino, US
• Jacob Newman · Palo Alto, US
• Jeffrey Blahnik · Volente, US
• Jason M. Schaller · Austin, US
• William T. Weaver · Austin, US
• Robert Brent Vopat · Austin, US
• Benjamin B. Riordon · Newburyport, US

Key dates

• Filing date: Oct 1, 2014
• Grant date: Jul 4, 2017
• Expiry date: Jul 1, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67303
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.