Real-time calibration for wafer processing chamber lamp modules
US9698065B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2015 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Oct 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B1/0233
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.