Patent · US Active

Electronic device with redistribution layer and stiffeners and related methods

US9698105B2 · kind B2 · utility

8Cited by
4References
21Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 30, 2016
Grant dateJul 4, 2017
Priority date—
Expiry dateAug 30, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3511
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method includes forming a molded panel that includes a number of integrated circuits, fan-out components and stiffeners embedded in an encapsulation material. A redistribution layer is formed over the integrated circuits and the fan-out components. The redistribution layer is electrically coupled to contacts of the integrated circuits. The molded panel is singulated to form electronic devices. Each electronic device each an integrated circuit that is separated from a fan-out component by a portion of the encapsulation material and a stiffener separated from the fan-out component by a second portion of the encapsulation material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.