Metal deposition on substrates
US9698106B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2016 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Mar 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various techniques, methods, devices and apparatus are provided where an isolation layer is provided at a peripheral region of the substrate, and one or more metal layers are deposited onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.