Grid array connection device and method
US9698114B2 · kind B2 · utility
1Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2011 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Mar 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.