Patent · US Active

Detachment of a self-supporting layer of silicon <100>

US9698289B2 · kind B2 · utility

4Cited by
10References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 1, 2013
Grant dateJul 4, 2017
Priority date
Expiry dateJul 1, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for detaching a self-supporting layer of silicon of crystalline orientation <100>, particularly with the aim of applications in the field of photovoltaics, wherein the method includes the steps of: a) Implanting ionic species in a substrate made of silicon having a crystalline orientation <100> so as to create an embrittlement plane in the substrate, delimiting on both sides a self-supporting layer and a negative of the substrate, and b) Applying a heat treatment to the substrate implanted at step a) with a temperature ramp greater than 30° C./s so as to detach the self-supporting layer of silicon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.