Detachment of a self-supporting layer of silicon <100>
US9698289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Jul 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for detaching a self-supporting layer of silicon of crystalline orientation <100>, particularly with the aim of applications in the field of photovoltaics, wherein the method includes the steps of: a) Implanting ionic species in a substrate made of silicon having a crystalline orientation <100> so as to create an embrittlement plane in the substrate, delimiting on both sides a self-supporting layer and a negative of the substrate, and b) Applying a heat treatment to the substrate implanted at step a) with a temperature ramp greater than 30° C./s so as to detach the self-supporting layer of silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.