Frédéric Mazen
23Patents
4h-index
31Co-inventors
59Inventor score
Filing activity: Nov 19, 2003 → Nov 18, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6946369B2 | Method for forming, by CVD, nanostructures of semi-conductor material of homogenous and controlled size on dielectric material | Emerging Cross-Sectional Technologies | 6 | Expired |
| US9698289B2 | Detachment of a self-supporting layer of silicon <100> | Emerging Cross-Sectional Technologies | 4 | Active |
| US9427948B2 | Manufacturing a flexible structure by transfers of layers | Emerging Cross-Sectional Technologies | 4 | Active |
| US9246006B2 | Recrystallization of source and drain blocks from above | Electricity | 4 | Active |
| US9966453B2 | Method for doping source and drain regions of a transistor by means of selective amorphisation | Electricity | 2 | Active |
| US9343375B2 | Method for manufacturing a transistor in which the strain applied to the channel is increased | Electricity | 2 | Active |
| US8293620B2 | Method of making multiple implantations in a substrate | Electricity | 2 | Active |
| US8778775B2 | Method for preparing thin GaN layers by implantation and recycling of a starting substrate | Electricity | 2 | Active |
| US9761607B2 | Method for producing strained semi-conductor blocks on the insulating layer of a semi-conductor on insulator substrate | Electricity | 2 | Active |
| US9105688B2 | Process for forming a crack in a material | Electricity | 1 | Active |
| US7943402B2 | Ion implantation process characterization method | Electricity | 1 | Active |
| US9201023B2 | System for measuring a spacing zone in a substrate | Physics | 1 | Active |
| US11195711B2 | Healing method before transfer of a semiconducting layer | Electricity | 1 | Active |
| US10950491B2 | Method for transferring a useful layer | Performing Operations; Transporting | 0 | Active |
| US11769687B2 | Method for layer transfer with localised reduction of a capacity to initiate a fracture | Electricity | 0 | Active |
| US12002697B2 | Method for detecting the splitting of a substrate weakened by implanting atomic species | Electricity | 0 | Active |
| US11587826B2 | Method for suspending a thin layer on a cavity with a stiffening effect obtained by pressurizing the cavity by implanted species | Performing Operations; Transporting | 0 | Active |
| US11189519B2 | Masking a zone at the edge of a donor substrate during an ion implantation step | Electricity | 0 | Active |
| US11670540B2 | Substrates including useful layers | Performing Operations; Transporting | 0 | Active |
| US11056340B2 | Direct bonding process | Electricity | 0 | Active |
| US12327719B2 | Semiconductor substrate polishing method | Electricity | 0 | Active |
| US7736919B2 | Method of producing a light-emitting diode comprising a nanostructured PN junction and diode thus obtained | Emerging Cross-Sectional Technologies | 0 | Expired |
| US9589830B2 | Method for transferring a useful layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.