Method of manufacture an electric circuit
US9699915B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | May 23, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.