Package assembly and method for manufacturing the same
US9699918B2 · kind B2 · utility
0Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2015 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Oct 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package assembly can include: (i) a plurality of electrical components stacked on at least two layers; (ii) a lead frame connected to the electrical components by solder interconnection; (iii) an encapsulating compound overlapping a portion of the lead frame and the electrical components to expose portions of leads of the lead frame from the encapsulating compound; and (iv) a heat sink having a first portion arranged between two of the plurality of electrical components, where the heat sink is configured to provide a common heat dissipation path for the electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.