Method of forming a wrap-around contact on a semiconductor device
US9704744B2 · kind B2 · utility
5Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2013 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Dec 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.