Mold compound with reinforced fibers
US9704767B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Dec 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and mechanisms for mitigating warpage of structures in a package. In an embodiment, a packaged integrated circuit device includes a mold compound disposed at least partially around an integrated circuit chip. The mold compound comprises fibers suspended in a media that is to aid in mechanical reinforcement of such fibers. The reinforced fibers contribute to mold compound properties that resist warping of the IC chip that might otherwise take place as a result of solder reflow or other processing. A modulus of elasticity of the mold compound is equal to or more than three GigePascals (3 GPa), where the modulus of elasticity corresponds to a temperature equal to two hundred and sixty degrees Celsius (260° C.). In another embodiment, a spiral flow value of the mold compound is equal to or more than sixty five centimeters (65 cm).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.