Direct selective adhesion promotor plating

US9704786B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Jochen Dangelmaier · Beratzhausen, DE
• Kim Huat Hoa · Melaka City, MY
• Hazrul Aland Abd Hamid · Kuala Pilah, MY
• Andreas Allmeier · Pfatter, DE
• Dietmar Lang · Regenstauf, DE

Key dates

• Filing date: Sep 25, 2015
• Grant date: Jul 11, 2017
• Expiry date: Sep 25, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.