Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package
US9704842B2 · kind B2 · utility
3Cited by
225References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2014 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Nov 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer having a multilayered conductive pattern portion that is constructed by repeating the direct printing on a carrier of one or more conductive pattern layers and application of one or more insulating layers between the printed conductive pattern layers is described. Also, a method for manufacturing the interposer, a semiconductor package using the interposer, and a method for fabricating the semiconductor package are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.