Method for slicing workpiece and wire saw
US9707635B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2012 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | May 31, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for slicing a workpiece into wafers by imparting axial reciprocating motion to a wire wound around a plurality of grooved rollers, and moving the workpiece relatively downwardly to press the workpiece against the reciprocating wire and feed the workpiece with the workpiece cut into while supplying a slurry to the wire, the method including the steps of: configuring each of the grooved rollers such that a distance from a bottom of grooves of the grooved roller to a rotating shaft of the grooved roller decreases gradually from a wire-supply side toward a wire-collection side; slicing the workpiece in such a manner that the workpiece is pressed against the wire on the wire-supply side before the workpiece is pressed against the wire on the wire-collection side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.