Patent · US Active

Micromechanical pressure sensor device and corresponding manufacturing method

US9709451B2 · kind B2 · utility

5Cited by

19References

14Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Arnd Kaelberer · Neckargemünd, DE
Jochen Reinmuth · Reutlingen, DE
Johannes Classen · Reutlingen, DE

Key dates

Filing date	Jan 8, 2015
Grant date	Jul 18, 2017
Priority date	—
Expiry date	Oct 3, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2201/0264
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micromechanical pressure sensor device includes: an MEMS wafer having a front side and a rear side; a first micromechanical functional layer formed above the front side of the MEMS wafer; and a second micromechanical functional layer formed above the first micromechanical functional layer. A deflectable first pressure detection electrode is formed in one of the first and second micromechanical functional layers. A fixed second pressure detection electrode is formed spaced apart from and opposite the deflectable first pressure detection electrode. An elastically deflectable diaphragm area is formed above the front side of the MEMS wafer. An external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, and the wafer is connected to the deflectable first pressure detection electrode via a plug-like joining area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.