Heat source integration for electromigration analysis
US9710577B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Oct 7, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer-implemented method includes receiving layout information associated with a circuit design at an extractor, and generating three-dimensional (3-D) heat source grid information based on the layout information, an extracted netlist, and wire information. The method also includes sending the wire information to an electromigration(EM)/current(IR) analyzer, sending the extracted netlist to a circuit simulator, and sending the 3-D heat source grid information to a thermal analysis component. The circuit simulator is configured to generate temperature waveforms and current waveforms based on the extracted netlist. The thermal analysis component is configured to generate heat source information to be provided to the EM/IR analyzer. The method further includes determining, at the EM/IR analyzer, an electromigration risk associated with a wire based on the wire information, the current waveforms, and the heat source information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.