Printed wiring board and method for manufacturing the same
US9711439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Sep 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes an insulating layer including insulating material, and a conductor layer formed on a surface of the insulating layer and including conductor pads and conductor patterns such that the conductor pads are positioned to connect one or more electronic components and that the conductor patterns are formed between the conductor pads. The conductor patterns are formed such that each conductor pattern has a pattern width of 3 μm or less and that the conductor patterns have a pattern interval of 3 μm or less between adjacent conductor patterns, and the insulating layer has recess portions formed on the surface between the conductor patterns at least along the conductor patterns such that the recess portions have a depth in a range of 0.1 μm to 2.0 μm relative to a contact interface at which the conductor patterns and the insulating layer are in contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.