Packaging module and substrate structure thereof
US9711444B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 9, 2016 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Aug 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.