Via structures for solar cell interconnection in solar module

US9711671B2 · kind B2 · utility

Assignee

• ALTA DEVICES, INC. · US

Inventors

• Linlin Yang · Sunnyvale, US
• Gang He · Magnolia Trace, CA
• Dan Patterson · Scottsdale, US
• Paul Arthur Goddu · معلمی نژاد, US
• Liguang LAN · Sunnyvale, US
• Gregg Higashi · San Jose, US

Key dates

• Filing date: Sep 18, 2015
• Grant date: Jul 18, 2017
• Expiry date: Sep 18, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/50

Abstract

System and method of providing a photovoltaic (PV) cell with a complex via structure in the substrate that has a primary via for containing a conductive material and an overflow capture region for capturing an overflow of the conductive material from the primary via. The conductive filling in the primary via may serve as an electrical contact between the PV cell and another PV cell. The overflow capture region includes one or more recesses formed on the substrate back surface. When the conductive material overflows from the primary via, the one or more recesses can capture and confine the overflow within the boundary of the complex via structure. A recess may be a rectangular or circular trench proximate to or overlaying the primary via. The recesses may also be depressions formed by roughening the substrate back surface.