Communication module
US9713259B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2014 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Mar 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0215
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit substrate having a built-in component includes a core layer that is a conductive layer in which a penetrating hole is formed. A component is disposed in this penetrating hole. A signal wiring line that transmits high frequency signals is formed in a conductive layer facing the core layer on an area projected in the thickness direction of the penetrating hole. The component is provided with a ground conductor functioning as ground that is formed on at least a portion of the area projected in the thickness direction of the signal wiring line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.