Context-based inspection for dark field inspection
US9715725B2 · kind B2 · utility
3Cited by
2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2014 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Apr 4, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.