Integrated optical sensor module
US9716193B2 · kind B2 · utility
3Cited by
41References
47Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 2, 2012 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Jul 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/95
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated optical sensor module includes an optical sensor die having an optical sensing area on its first surface, and an application-specific integrated circuit (ASIC) die arranged over the first surface of the optical sensor die. A hole in the ASIC die is at least partially aligned with the optical sensing area such that at least some of the light passing through the hole may contact the optical sensing area. The hole through the ASIC die can be configured to receive an optical fiber, lens structure, or other optical element therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.