Apparatus and a method for treating a substrate
US9721801B2 · kind B2 · utility
0Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.