Method for mounting semiconductors provided with bumps on substrate locations of a substrate
US9721819B2 · kind B2 · utility
2Cited by
2References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Aug 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.