Heat exchanger methods, apparatuses and systems with a manifold structure
US9721871B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Dec 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1432
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.