Apparatus and methods for multi-die packaging
US9721881B1 · kind B1 · utility
8Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Apr 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor device assembly includes forming an interposer having an opening extending from a first major surface to a second major surface of the interposer and a plurality of external connectors on the second major surface. The method further includes attaching the first major surface of the interposer to a packaged semiconductor device, wherein the opening of the interposer exposes the packaged semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.