Circuits and methods providing mutual capacitance in vertical electrical connections
US9722012B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Sep 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical device including a structure having a plurality of dielectric layers, the structure further having a plurality of vertical electrical connections extending from a top layer of the dielectric layers to a bottom layer of the dielectric layers, a first vertical electrical connection of the plurality of vertical electrical connections including a first capacitive structure that extends in a plane perpendicular to a vertical dimension of the vertical electrical connection, wherein the first capacitive structure is disposed on a first dielectric layer of the plurality of dielectric layers, wherein the first dielectric layer is below the top layer, and a second vertical electrical connection of the plurality of vertical electrical connections including a second capacitive structure extending in the plane and disposed on the first dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.