Priyatharshan Pathmanathan
3Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Jul 11, 2014 → Jul 25, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9722012B1 | Circuits and methods providing mutual capacitance in vertical electrical connections | Electricity | 4 | Active |
| US9214426B1 | Highly coupled spiral planar inductors structure at bump to compensate on die excess capacitance of differential I/O | Electricity | 1 | Active |
| US10349513B2 | Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.