Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure
US9723716B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2013 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Apr 26, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, a contact pad structure may be provided, the contact pad structure may include: a dielectric layer structure; at least one contact pad being in physical contact with the dielectric layer structure; the at least one contact pad including a metal structure and a liner structure, wherein the liner structure is disposed between the metal structure of the at least one contact pad and the dielectric layer structure, and wherein a surface of the at least one contact pad is at least partially free from the liner structure, and a contact structure including an electrically conductive material; the contact structure completely covering at least the surface being at least partially free from the liner structure of the at least one contact pad, wherein the liner structure and the contact structure form a diffusion barrier for a material of the metal structure of the at least one contact pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.