Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus
US9724798B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2015 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Mar 27, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.