Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting

US9725311B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jochen Franz · Reutlingen, DE
• Simon Armbruster · Wannweil, DE
• Helmut Grutzeck · Tübingen, DE
• Joerg Muchow · Reutlingen, DE
• Frederic Njikam Njimonzie · Reutlingen, DE
• Andreas Duell · Stuttgart, DE
• Johannes Baader · Glückstadt, DE
• Stefan Liebing · Rottenburg am Neckar, DE
• Rainer Straub · Entringen, DE

Key dates

• Filing date: Feb 4, 2015
• Grant date: Aug 8, 2017
• Expiry date: Feb 4, 2035

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0109
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.