Semiconductor chips with seal rings and electronic test structures, semiconductor wafers including the semiconductor chips, and methods for fabricating the same
US9728474B1 · kind B1 · utility
9Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2016 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Sep 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes an active area including a plurality of integrated circuit structures, a seal ring enclosing the active area, a corner area of the semiconductor chip that is outside of the seal ring, and an electronic test structure disposed within the corner area. Semiconductor wafers including the above-noted semiconductor chips, as well as methods for fabricating semiconductor wafers including the above-noted semiconductor chips, are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.