Wanbing Yi
74Patents
7h-index
71Co-inventors
71Inventor score
Filing activity: May 30, 2013 → Jun 9, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9875971B2 | Magnetic shielding of MRAM package | Electricity | 190 | Active |
| US9865649B2 | Integrated two-terminal device and logic device with compact interconnects having shallow via for embedded application | Electricity | 24 | Active |
| US10290679B1 | High-Density STT-MRAM with 3D arrays of MTJs in multiple levels of interconnects and method for producing the same | Electricity | 18 | Active |
| US10580968B1 | Integrated circuit with memory cells having reliable interconnection | Electricity | 15 | Active |
| US10199572B2 | Integrated magnetic random access memory with logic device | Electricity | 11 | Active |
| US9728474B1 | Semiconductor chips with seal rings and electronic test structures, semiconductor wafers including the semiconductor chips, and methods for fabricating the same | Electricity | 9 | Active |
| US9397139B1 | Integrated inductor and magnetic random access memory device | Electricity | 8 | Active |
| US10096768B2 | Magnetic shielding for MTJ device or bit | Electricity | 7 | Active |
| US9972775B2 | Integrated magnetic random access memory with logic device having low-k interconnects | Electricity | 6 | Active |
| US9349772B2 | Methods for fabricatingintegrated circuits with spin torque transfer magnetic randomaccess memory (STT-MRAM) including a passivation layer formed along lateral sidewalls of a magnetic tunnel junction of the STT-MRAM | Electricity | 6 | Active |
| US10347826B1 | STT-MRAM flip-chip magnetic shielding and method for producing the same | Electricity | 6 | Active |
| US10062733B1 | Integrated circuits with magnetic tunnel junction memory cells and methods for producing the same | Electricity | 5 | Active |
| US9905282B1 | Top electrode dome formation | Electricity | 5 | Active |
| US9553129B2 | Magnetic tunnel junction stack alignment scheme | Electricity | 4 | Active |
| US9520371B2 | Planar passivation for pads | Electricity | 4 | Active |
| US10446607B2 | Integrated two-terminal device with logic device for embedded application | Electricity | 4 | Active |
| US10490745B2 | Vertical and planar RRAM with tip electrodes and methods for producing the same | Electricity | 4 | Active |
| US10461247B2 | Integrated magnetic random access memory with logic device having low-K interconnects | Electricity | 4 | Active |
| US10483461B2 | Embedded MRAM in interconnects and method for producing the same | Electricity | 3 | Active |
| US9917027B2 | Integrated circuits with aluminum via structures and methods for fabricating the same | Electricity | 3 | Active |
| US9111941B2 | Non-volatile memory device with TSI/TSV application | Electricity | 3 | Active |
| US9786839B2 | 3D MRAM with through silicon vias or through silicon trenches magnetic shielding | Electricity | 3 | Active |
| US10361162B1 | Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same | Electricity | 3 | Active |
| US10693054B2 | MTJ bottom metal via in a memory cell and method for producing the same | Electricity | 2 | Active |
| US9490423B2 | Integrated circuit structures with spin torque transfer magnetic random access memory ultilizing aluminum metallization layers and methods for fabricating the same | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.