Fingerprint sensor and manufacturing method thereof
US9728476B2 · kind B2 · utility
10Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2016 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | May 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.