Automated inline inspection and metrology using shadow-gram images
US9734568B2 · kind B2 · utility
13Cited by
2References
15Claims
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Key dates
| Filing date | Feb 24, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Feb 24, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.