Patent · US Active

Apparatus for separating wafer from carrier

US9735039B2 · kind B2 · utility

6Cited by

14References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Chien Ling Hwang · Baoshan, TW
Lin-Wei Wang · Langfang, CN
Chung-Shi Liu · Baoshan, TW

Key dates

Filing date	Aug 21, 2014
Grant date	Aug 15, 2017
Priority date	—
Expiry date	Nov 16, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1978
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.