Systems and methods for thermal control of integrated circuits
US9735088B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/931
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.