Thermal management for flexible integrated circuit packages
US9735089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Sep 24, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are systems and methods for thermal management of a flexible integrated circuit (IC) package. In some embodiments, a flexible IC package may include a flexible substrate material; a component disposed in the flexible substrate material; a channel disposed in the flexible substrate material forming a closed circuit and having a portion proximate to the component; electrodes disposed in the flexible substrate material and positioned at locations proximate to the channel, wherein the electrodes are coupled to an electrode controller to selectively cause one or more of the electrodes to generate an electric field; and an electrolytic fluid disposed in the channel. In some embodiments, a flexible IC package may be coupled to a wearable support structure. Other embodiments may be disclosed and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.