Siddarth Kumar
7Patents
2h-index
9Co-inventors
36Inventor score
Filing activity: May 10, 2011 → Dec 30, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8454023B2 | Retractable seal system | Mechanical Engineering; Lighting; Heating | 5 | Active |
| US10748844B2 | Stress isolation for silicon photonic applications | Electricity | 5 | Active |
| US9953934B2 | Warpage controlled package and method for same | Electricity | 2 | Active |
| US9735089B2 | Thermal management for flexible integrated circuit packages | Emerging Cross-Sectional Technologies | 2 | Active |
| US9659908B1 | Systems and methods for package on package through mold interconnects | Emerging Cross-Sectional Technologies | 2 | Active |
| US11276625B2 | Methods of forming flexure based cooling solutions for package structures | Electricity | 0 | Active |
| US9930793B2 | Electric circuit on flexible substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.