Patent · US Active

Chemical mechanical polishing pad, polishing layer analyzer and method

US9737971B2 · kind B2 · utility

2Cited by

13References

9Claims

0Family size

Assignees

Inventors

Francis V. Acholla · Yardley, US
Andrew Wank · Avondale, US
Mark Gazze · McKeesport, US
Scott Chang · Taipei, TW
Jeff Tsai · Zhunan Town, TW
William A. Heeschen · Midland, US
James D. Tate · Lake Jackson, US
Leo H. Chiang · Pearland, US
Swee-Teng Chin · Pearland, US

Key dates

Filing date	Jan 12, 2016
Grant date	Aug 22, 2017
Priority date	—
Expiry date	Mar 5, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/22
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.